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This machine is mainly used in mobile phones of non-metallic materials such as glass and ceramics. 2.5D, 3D cover polishing. And also for metal material back cover such as aluminum alloy.


MAIN FEATURES:

·Adopting 4 station structure, three-station polishing can realize the rough, medium-precision and precision three-stage process in one machine.

·Rotating lower polishing plate can realize non-stop loading and unloading to improve equipment efficiency.

·Easy to install, automatic liquid discharge, stable and reliable polishing.

·Flexible loading system for efficient polishing of hard and brittle parts.·Touch screen man-machine interface, PLC control, friendly interface, large amount of information.

设备行程（磨组导轨上银）

Equipment stroke (grinding group guide:HIWIN)

X轴行程150(mX 轴行程 150(mm)、X-axis stroke

Y 轴行程 150(mm) 、Y-axis stroke

Z 轴行程 150mm  Z-axis stroke

设备移动速度Equipment movement speed

X 轴 10 米 /min、 Y 轴 10 米 /min 、Z 轴 10 米 /min

X axis 10M/Min、Y axis 10M/Min、Z axis 10M/Min

定位精度positioning accuracy

±0.02/150mm

重复定位精度Repeatability

±0.03/150mm

进口CNC控制系统Imported CNC control system

12轴  axis

工件数量Number of workpieces

4

磨头数量Number of grinding heads

3

加工范围Processing range

5kgf/cm²

气压Air pressure

11kw 100r/min

电压Voltage

380V/50HZ

功率power

7.5KW

设备外形尺寸（长×宽×高）Equipment dimensions (L×W×H)

1980×1450×1980（mm）

设备重量Equipment weight

2000KG